550-10-256M20-001166

Invent, Innovate, Integrate

Images are for reference only. See Product Specifications for product details.

Part Number	550-10-256M20-001166
Manufacturer	Preci-Dip
Description	BGA PIN ADAPTER 1.27MM SMD
Category	Connectors, Interconnects
Subcategory	Sockets for ICs, Transistors
Type	BGA
Series	550
Features	Closed Frame
Packaging	Bulk
Pitch Post	0.050" (1.27mm)
Pitch Mating	0.050" (1.27mm)
Termination	Solder
Mounting Type	Through Hole
Current Rating	1A
Housing Material	FR4 Epoxy Glass
Contact Finish Post	Gold
Contact Resistance	10 mOhm
Contact Finish Mating	Gold
Contact Material Post	Brass
Operating Temperature	-55°C ~ 125°C
Contact Material Mating	Beryllium Copper
Termination Post Length	0.098" (2.50mm)
Lead Free Status Ro H S Status	Lead free / RoHS Compliant
Contact Finish Thickness Post	10.0µin (0.25µm)
Material Flammability Rating	UL94 V-0
Moisture Sensitivity Level M S L	1 (Unlimited)
Numberof Positionsor Pins Grid	256 (20 x 20)
Contact Finish Thickness Mating	10.0µin (0.25µm)

Loading security check...

Please verify you are human by completing the security check.