FI-XB30SSLA-HF15
Images are for reference only. See Product Specifications for product details.
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Images are for reference only. See Product Specifications for product details.
| Part Number | FI-XB30SSLA-HF15 |
| Manufacturer | JAE Electronics, Inc. |
| Description | CONN RCPT 1MM 30POS R/A SMD |
| Datasheet | View Datasheet |
| Category | Connectors, Interconnects |
| Subcategory | Rectangular Connectors - Headers, Receptacles, Female Sockets |
| Style | Board to Cable/Wire |
| Series | FI-X |
| Features | Grounding Pins, Shielded, Solder Retention |
| Packaging | Tray |
| Other Names | 670-2893 FI-XB30SSLA-HF15-ND |
| Contact Type | Non-Gendered |
| Pitch Mating | 0.039" (1.00mm) |
| Termination | Solder |
| Applications | General Purpose |
| Mounting Type | Board Cutout, Bottom Mount, Surface Mount, Right Angle |
| Numberof Rows | 1 |
| Connector Type | Receptacle |
| Current Rating | 1A per Contact |
| Fastening Type | Friction Lock |
| Voltage Rating | 200V |
| Contact Material | Copper Alloy |
| Insulation Color | Beige |
| Contact Finish Post | Tin |
| Numberof Positions | 30 |
| Insulation Material | Plastic |
| Contact Finish Mating | Gold |
| Detailed Description | 420416 |
| Operating Temperature | -40°C ~ 80°C |
| Numberof Positions Loaded | All |
| Lead Free Status Ro H S Status | Lead free / RoHS Compliant |
| Material Flammability Rating | UL94 V-0 |
| Moisture Sensitivity Level M S L | 1 (Unlimited) |
| Contact Finish Thickness Mating | 3.90µin (0.099µm) |