HPM-08-02-T-S
Images are for reference only. See Product Specifications for product details.
Invent, Innovate, Integrate
Images are for reference only. See Product Specifications for product details.
| Part Number | HPM-08-02-T-S |
| Manufacturer | 4D Systems |
| Description | .200 HIGH POWER BLOCK ASSEMBLY |
| Category | Connectors, Interconnects |
| Subcategory | Rectangular Connectors - Headers, Male Pins |
| Style | Board to Board |
| Series | HPM |
| Shrouding | 0.200" (5.08mm) |
| Ro H S Status | Tube |
| Termination | Solder |
| Mounting Type | Through Hole |
| Numberof Rows | 1 |
| Connector Type | Header |
| Actual Diameter | Black |
| Insulation Height | 0.800" (20.32mm) |
| Row Spacing Mating | Unshrouded |
| Contact Length Post | 0.520" (13.21mm) |
| Numberof Positions | 8 |
| Shield Termination | Square |
| Stacking Direction | Male Pin |
| Insulation Material | Tin |
| Material Insulation | All |
| Contact Finish Mating | 0.100" (2.54mm) |
| Expanded Description | 8 Positions Header Connector Through Hole |
| Operating Temperature | -55°C ~ 105°C |
| Overall Contact Length | 0.180" (4.57mm) |
| Voltage D C Spark Over Nom | Copper Alloy |
| Manufacturer Part Number | HPM-08-02-T-S |
| Lead Free Status Ro H S Status | Lead free / RoHS Compliant |
| Contact Finish Thickness Post | Polyester, Glass Filled |
| Moisture Sensitivity Level M S L | 1 (Unlimited) |
| Contact Finish Thickness Mating | Tin |