Invent, Innovate, Integrate
English
English
Deutsch
Français
Español
Italiano
中文
हिन्दी
Lietuviškai
Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Termination Style | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0097063116 | Laird Technologies | CLO,STR,TLN,ZNY | - | 121°C | - | - | - | - | - | - | - | |
| 4695PA51H01800 | Laird Technologies | GASKT FABRIC/FOAM 9.5X457.2MM SQ | - | - | - | - | - | - | - | - | - | |
| 4570PA01H01800 | Laird Technologies | GASKET FAB/FOAM 5.1X457.2MM RECT | - | - | - | - | - | - | - | - | - | |
| 81-02-11818-2000 | Parker Chomerics | FINGERSTOCK 0.03X0.23X16" | - | -40°C ~ 121°C | - | - | - | - | - | - | - | |
| 4797AB51K06300 | Laird Technologies | GK NICU NRS PU V0 KN | - | - | - | - | - | - | - | - | - | |
| 3020603 | Wurth Electronics | GASKET FABRIC/FOAM 6MMX1M RECT | WE-LT | -40°C ~ 85°C | - | - | - | - | - | - | - | |
| 4741AB51K00242 | Laird Technologies | GK NICU NRS PU V0 REC | - | - | - | - | - | - | - | - | - | |
| 8406010961 | Laird Technologies | ENSL,SILSP,SCF,PSA,RL | - | -75°C ~ 260°C | - | - | - | - | - | - | - | |
| 22-60AH-SN-16 | Leader Tech Inc. | 0.22 X 0.60 SN 16--22-60AH-SN-16 | - | -55°C ~ 121°C | - | - | - | - | - | - | - | |
| 0078001519 | Laird Technologies | SLMT,1F,NIB,USFT | Slot Mount | 121°C | - | - | - | - | - | - | - |
RFI (Radio-Frequency Interference) and EMI (Electromagnetic Interference) contacts, fingerstock, and gaskets are components used to provide electromagnetic shielding and grounding in electronic enclosures and systems. They help prevent the ingress and egress of unwanted electromagnetic radiation, minimizing interference and noise that can affect the performance of sensitive electronic circuits. RFI and EMI shielding components include conductive contacts, fingerstock strips, gaskets, and shielding materials made from materials such as conductive elastomers, metal alloys, and conductive foams. They are essential for maintaining electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards in electronic products and systems.