Invent, Innovate, Integrate
English
English
Deutsch
Français
Español
Italiano
中文
हिन्दी
Lietuviškai
Loading products…
| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Termination Style | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 11-S-37FSC-BD-16 | Leader Tech Inc. | 0.11 X 0.375 BD 16--FOLDED SERIE | - | -55°C ~ 121°C | - | - | - | - | - | - | - | |
| 0077008102 | Laird Technologies | GASKET BECU 7.11X609.6MM | No Snag | 121°C | - | - | - | - | - | - | - | |
| 4120PA51H01800 | Laird Technologies | D-SHAPE | - | - | - | - | - | - | - | - | - | |
| 0077002417 | Laird Technologies | SLMT,2F,SNB | Slot Mount | 121°C | - | - | - | - | - | - | - | |
| 10-04-2737-1298 | Parker Chomerics | CHO-SEAL 1298 AG/AL EMI 0.250" | - | -29°C ~ 66°C | - | - | - | - | - | - | - | |
| 11-32AH-BD-16 | Leader Tech Inc. | COPPER BERYLLIUM FINGERSTOCK EMI | - | - | - | - | - | - | - | - | - | |
| 3-2199250-2 | Agastat Relays / TE Connectivity | 2.9H SPRNG FINGER TYPE C SMT | - | - | - | - | - | - | - | - | - | |
| 4049AB51K01200 | Laird Technologies | GASKET FAB/FOAM 6.35X304.8MM SQ | - | - | - | - | - | - | - | - | - | |
| 67B3G2507009010R0B | Laird Technologies | SP,CON,3,AU,TNR | - | - | - | - | - | - | - | - | - | |
| 22-60RH-BD-16 | Leader Tech Inc. | 0.22 X 0.60 BD 16--22-60RH-BD-16 | - | -55°C ~ 121°C | - | - | - | - | - | - | - |
RFI (Radio-Frequency Interference) and EMI (Electromagnetic Interference) contacts, fingerstock, and gaskets are components used to provide electromagnetic shielding and grounding in electronic enclosures and systems. They help prevent the ingress and egress of unwanted electromagnetic radiation, minimizing interference and noise that can affect the performance of sensitive electronic circuits. RFI and EMI shielding components include conductive contacts, fingerstock strips, gaskets, and shielding materials made from materials such as conductive elastomers, metal alloys, and conductive foams. They are essential for maintaining electromagnetic compatibility (EMC) and ensuring compliance with regulatory standards in electronic products and systems.