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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
EFR32MG12P433F1024GM68-C | Energy Micro (Silicon Labs) | MIGHTY GECKO DUAL MESH MULTI-PRO | - | - | Tray | - | - | - | - | 68-VFQFN Exposed Pad | - |
|
EM2420-RTR | Energy Micro (Silicon Labs) | IC RF TXRX 802.15.4 48-QLP | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-QLP | - |
|
SI4455-C2A-GMR | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 20-VFQFN | - | -40°C ~ 85°C | Cut Tape (CT) | - | - | - | - | 20-VFQFN Exposed Pad | - |
|
EFR32BG13P632F512GM48-CR | Energy Micro (Silicon Labs) | BLUE PREMIUM QFN48 2.4G 10 DBM B | - | -40°C ~ 85°C | Tape & Reel (TR) | - | RoHS Compliant | - | - | 48-VFQFN Exposed Pad | - |
|
EZR32LG230F64R55G-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32LG | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 64-VFQFN Exposed Pad | - |
|
ADF7242BCPZ-RL | ADI (Analog Devices, Inc.) | IC RF TXRX+MCU 802.15.4 32-WFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-WFQFN Exposed Pad, CSP | ADF7242 |
|
EFR32MG12P432F1024GL125-C | Energy Micro (Silicon Labs) | MIGHTY GECKO BGA125 2.4G 19DB ME | Mighty Gecko | - | Tray | - | - | - | - | 125-VFBGA | - |
|
MC13226VR2 | NXP Semiconductors / Freescale | IC RF TXRX+MCU 802.15.4 145TFLGA | - | -40°C ~ 105°C | Tape & Reel (TR) | - | - | - | - | 145-TFLGA | - |
|
|
EZR32WG330F64R61G-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32WG | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 64-VFQFN Exposed Pad | - |
|
ATSAMR21E17A-MUT | Micrel / Microchip Technology | IC RF TXRX+MCU ISM>1GHZ 32-VFQFN | SMART™ SAM R21 | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-VFQFN Exposed Pad | - |
About RF Transceiver ICs
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.