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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
EFR32FG12P431F1024GM68-CR | Energy Micro (Silicon Labs) | FLEX GECKO DUAL PROPRIETARY | Flex Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 68-VFQFN Exposed Pad | - |
|
EFR32MG12P132F1024GL125-CR | Energy Micro (Silicon Labs) | MIGHTY GECKO | Mighty Gecko | - | Tape & Reel (TR) | - | - | - | - | 125-VFBGA | - |
|
SX1257IWLTRT | Semtech | IC RF TXRX 802.15.4 32WFQFN | - | -40°C ~ 85°C | Cut Tape (CT) | - | - | - | - | 32-WFQFN Exposed Pad | - |
|
EZR32WG330F128R69G-B0 | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32WG | -40°C ~ 85°C | Tray | - | - | - | - | 64-VFQFN Exposed Pad | - |
|
EFR32BG13P732F512GM48-BR | Energy Micro (Silicon Labs) | BLUE PREMIUM QFN48 2.4G 19 DBM B | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
TC32306FTG,EL | Toshiba Semiconductor and Storage | IC RF TXRX ISM<1GHZ 36-VFQFN | - | -40°C ~ 110°C | Tape & Reel (TR) | - | - | - | - | 36-VFQFN Exposed Pad | - |
|
SI1024-A-GM | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 85-VFLGA | - | -40°C ~ 85°C | Tray | - | - | - | - | 85-VFLGA Exposed Pad | - |
|
SI1023-B-GM3R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 85-VFLGA | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 85-VFLGA Exposed Pad | - |
|
LTC5800IWR-IPRB#PBF | ADI (Analog Devices, Inc.) | IC RF TXRX+MCU 802.15.4 72-VFQFN | Dust Networks®, SmartMesh IP™ | -40°C ~ 85°C | Tray | - | - | - | - | 72-VFQFN Exposed Pad | LTC5800 |
|
|
CC1310F64RGZR | N/A | IC RF TXRX+MCU ISM<1GHZ 48-VFQFN | SimpleLink™ | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - |
About RF Transceiver ICs
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.