| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Type | Voltage - Supply | Shell Style | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CYW20732S | Cypress Semiconductor | IC RF TXRX+MCU BLUETOOTH 48SMD | - | -30°C ~ 85°C | Tray | - | - | TxRx + MCU | 1.4 V ~ 3.6 V | - | 48-SMD Module | |
| EZR32LG330F256R67G-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32LG | -40°C ~ 85°C | Tape & Reel (TR) | - | - | TxRx + MCU | 1.98 V ~ 3.8 V | - | 64-VFQFN Exposed Pad | |
| EFR32BG1B132F256GM32-C0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU BLUETOOTH 32QFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | TxRx + MCU | 1.85 V ~ 3.8 V | - | 32-VFQFN Exposed Pad | |
| EFR32FG12P231F512GM68-CR | Energy Micro (Silicon Labs) | FLEX GECKO DUAL PROPRIETARY | Flex Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | TxRx + MCU | 1.8 V ~ 3.8 V | - | 68-VFQFN Exposed Pad | |
| JN5139/Z01,518 | NXP Semiconductors / Freescale | IC RF TXRX+MCU 802.15.4 56-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | TxRx + MCU | 2.2 V ~ 3.6 V | - | 56-VFQFN | |
| SI1012-A-GM | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 42-WFQFN | - | -40°C ~ 85°C | Tube | - | - | TxRx + MCU | 1.8 V ~ 3.6 V | - | 42-WFQFN Exposed Pad | |
| MC13234CHTR | NXP Semiconductors / Freescale | S08 8-BIT MCU S08 CORE 128KB F | - | - | Tape & Reel (TR) | - | - | - | - | - | - | |
| LMS6002DFN | Lime Microsystems | IC RF TXRX CELLULAR 120-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | TxRx Only | 1.7 V ~ 3.5 V | - | 120-VFQFN Dual Rows, Exposed Pad | |
| SI4464-B1X-FM | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 20-VFQFN | - | -40°C ~ 85°C | Tube | - | - | TxRx + MCU | 1.8 V ~ 3.6 V | - | 20-VFQFN Exposed Pad | |
| SI1081-A-GM | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 36-WFQFN | - | -40°C ~ 85°C | Tray | - | - | TxRx + MCU | 1.8 V ~ 3.6 V | - | 36-WFQFN Exposed Pad |
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.