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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STA2500DCTR | STMicroelectronics | IC RF TXRX+MCU BLUETOOTH 48LFBGA | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-LFBGA | - | |
| CC1310F32RHBR | N/A | IC RF TXRX+MCU ISM<1GHZ 32-VFQFN | SimpleLink™ | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-VFQFN Exposed Pad | - | |
| EFR32FG12P431F1024GL125-BR | Energy Micro (Silicon Labs) | FLEX GECKO BGA125 SUBG 20DB PROP | Flex Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 125-VFBGA | - | |
| AD9371BBCZ-REEL | ADI (Analog Devices, Inc.) | IC RF TXRX 300-6000MHZ 196CSBGA | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 196-LFBGA, CSPBGA | AD9371 | |
| ADF7242BCPZ | ADI (Analog Devices, Inc.) | IC RF TXRX+MCU 802.15.4 32-WFQFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 32-WFQFN Exposed Pad, CSP | ADF7242 | |
| EM3598-RT | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 56-VFQFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 56-VFQFN Exposed Pad | - | |
| EFR32FG1P132F128GM48-B0 | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM>1GHZ 48-VFQFN | Flex Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| CYW20705B0KWFBGT | Cypress Semiconductor | IC RF TXRX+MCU BLUETOOTH 49FBGA | - | -30°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 50-WFBGA | - | |
| ATMEGA1284RFR2-ZFR | Micrel / Microchip Technology | IC RF TXRX+MCU 802.15.4 48-VFQFN | - | -40°C ~ 125°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32MG1P232F256GM32-B0 | Energy Micro (Silicon Labs) | IC MCU 32BIT 256KB 32QFN | Mighty Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 32-VFQFN Exposed Pad | - |
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.