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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CC2500RTK | N/A | IC RF TXRX ISM>1GHZ 20-VFQFN | - | -40°C ~ 85°C | Tube | - | - | - | - | 20-VFQFN Exposed Pad | - | |
| MC13191FCR2 | NXP Semiconductors / Freescale | IC RF TXRX ISM>1GHZ 32-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-VFQFN Exposed Pad | - | |
| AX5042-1-TA05 | AMI Semiconductor / ON Semiconductor | IC RF TXRX ISM<1GHZ 28-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 28-VFQFN Exposed Pad | - | |
| EFR32MG13P632F512GM32-CR | Energy Micro (Silicon Labs) | MIGHTY GECKO MESH MULTI-PROTOCOL | Mighty Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32BG1B132F256GM32-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU BLUETOOTH 32QFN | EFR32™ Blue Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-VFQFN Exposed Pad | - | |
| SI4464-B1B-FM | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 20-VFQFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 20-VFQFN Exposed Pad | - | |
| EZR32LG230F64R60G-B0 | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32LG | -40°C ~ 85°C | Tray | - | - | - | - | 64-VFQFN Exposed Pad | - | |
| MAX2511EEI | Maxim Integrated | IC RF TXRX ISM<1GHZ 28-SSOP | - | -40°C ~ 85°C | Tube | - | - | - | - | 28-SSOP (0.154", 3.90mm Width) | - | |
| SI1021-A-GM | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 85-VFLGA | - | -40°C ~ 85°C | Tray | - | - | - | - | 85-VFLGA Exposed Pad | - | |
| SI1026-B-GM3R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 85-VFLGA | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 85-VFLGA Exposed Pad | - |
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.