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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
EZR32LG230F256R69G-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32LG | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 64-VFQFN Exposed Pad | - |
|
EM3596-RTR | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 56-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 56-VFQFN Exposed Pad | - |
|
EFR32MG12P332F1024GM48-C | Energy Micro (Silicon Labs) | MIGHTY GECKO | Mighty Gecko | - | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
EFR32BG1P232F256GM48-C0 | Energy Micro (Silicon Labs) | BLUE GECKO PREMIUM | - | -40°C ~ 85°C | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
|
CC430F5125IRGZT | N/A | IC RF TXRX+MCU ISM<1GHZ 48-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
EFR32MG13P733F512GM48-CR | Energy Micro (Silicon Labs) | MIGHTY PREMIUM QFN48 DUAL 19 DBM | - | -40°C ~ 85°C | Tape & Reel (TR) | - | RoHS Compliant | - | - | 48-VFQFN Exposed Pad | - |
|
|
EZR32WG330F64R60G-B0 | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32WG | -40°C ~ 85°C | Tray | - | - | - | - | 64-VFQFN Exposed Pad | - |
|
DA14580-01A32 | Dialog Semiconductor | IC RF TXRX+MCU BLUETOOTH 48VFQFN | - | -40°C ~ 85°C | Cut Tape (CT) | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
|
EZR32HG220F32R68G-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 48-QFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
BGT80E6327XTSA1 | International Rectifier (Infineon Technologies) | IC MMIC 119WFWLB | - | - | Tape & Reel (TR) | - | - | - | - | 119-WFBGA | - |
About RF Transceiver ICs
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.