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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
BC417143B-IQN-E4 | CSR PLC (Qualcomm) | IC RF TXRX+MCU BLUETOOTH 96TFBGA | BlueCore® | -40°C ~ 105°C | Tape & Reel (TR) | - | - | - | - | 96-TFBGA | - |
|
EFR32FG1V131F32GM48-C0 | Energy Micro (Silicon Labs) | IC SOC 8KB 32KB FLASH 48QFN | - | - | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
EFR32MG12P432F1024GL125-B | Energy Micro (Silicon Labs) | MIGHTY GECKO BGA125 2.4G 19DB ME | Mighty Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 125-VFBGA | - |
|
CYW20732A0KML2G | Cypress Semiconductor | IOT BLUETOOTH 802.15.4 | - | -30°C ~ 85°C | Tray | - | - | - | - | 32-VFQFN Exposed Pad | - |
|
ATSAMR21G17A-MUT | Micrel / Microchip Technology | IC RF TXRX+MCU ISM>1GHZ 48-VFQFN | SMART™ SAM R21 | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
CYW20732S | Cypress Semiconductor | IC RF TXRX+MCU BLUETOOTH 48SMD | - | -30°C ~ 85°C | Tray | - | - | - | - | 48-SMD Module | - |
|
EZR32LG330F256R67G-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32LG | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 64-VFQFN Exposed Pad | - |
|
EFR32BG1B132F256GM32-C0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU BLUETOOTH 32QFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-VFQFN Exposed Pad | - |
|
EFR32FG12P231F512GM68-CR | Energy Micro (Silicon Labs) | FLEX GECKO DUAL PROPRIETARY | Flex Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 68-VFQFN Exposed Pad | - |
|
JN5139/Z01,518 | NXP Semiconductors / Freescale | IC RF TXRX+MCU 802.15.4 56-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 56-VFQFN | - |
About RF Transceiver ICs
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.