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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CC3220MODASM2MONR | N/A | CC3220 WI-FI MODULE LARGE REEL | SimpleLink™ | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 63-SMD Module | - | |
| EZR32HG220F32R69G-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 48-QFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| NRF52810-QFAA-R | Nordic Semiconductor | NRF52810-QFAA QFN 48 PIN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32MG1P232F256GM48-B0R | Energy Micro (Silicon Labs) | IC MCU 32BIT 256KB 48QFN | Mighty Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32FG13P233F512GM48-BR | Energy Micro (Silicon Labs) | FLEX PREMIUM QFN48 DUAL 19 DBM N | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| SI1027-B-GM | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 85-VFLGA | - | -40°C ~ 85°C | Tray | - | - | - | - | 85-VFLGA Exposed Pad | - | |
| NRF51422-CFAC-R | Nordic Semiconductor | IC RF TXRX+MCU BLUETOOTH 62WLCSP | - | -25°C ~ 75°C | Tape & Reel (TR) | - | - | - | - | 62-UFBGA, WLCSP | - | |
| SI4461-B0B-FM | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 20-VFQFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 20-VFQFN Exposed Pad | - | |
| AT86RF233-ZU | Micrel / Microchip Technology | IC RF TXRX+MCU 802.15.4 32-VFQFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 32-VFQFN Exposed Pad | - | |
| EFR32FG1V132F256GM48-B0 | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM>1GHZ 48-VFQFN | Flex Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - |
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.