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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EZR32LG230F256R63G-B0 | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32LG | -40°C ~ 85°C | Tray | - | - | - | - | 64-VFQFN Exposed Pad | - | |
| SI1063-A-GM | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 36-WFQFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 36-WFQFN Exposed Pad | - | |
| ATMEGA1284PR231-AU | Micrel / Microchip Technology | IC RF TXRX+MCU 802.15.4 44-TQFP | - | -40°C ~ 85°C | Tray | - | - | - | - | 44-TQFP | - | |
| EFR32MG12P132F1024GL125-B | Energy Micro (Silicon Labs) | MIGHTY GECKO BGA125 2.4G 10DB ME | Mighty Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 125-VFBGA | - | |
| SI1011-A-GMR | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 42-WFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 42-WFQFN Exposed Pad | - | |
| EFR32MG12P231F1024GM68-C | Energy Micro (Silicon Labs) | MIGHTY GECKO MESH MULTI-PROTOCOL | Mighty Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 68-VFQFN Exposed Pad | - | |
| ATWILC3000A-MU-T | Micrel / Microchip Technology | IC SOC RF LINK CTLR/BT 4.0 48QFN | - | -40°C ~ 85°C | Cut Tape (CT) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32BG12P132F1024GM48-B | Energy Micro (Silicon Labs) | BLUE GECKO QFN48 2.4G 0DB BLE/PR | Blue Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32BG1V132F128GM48-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU BLUETOOTH 48QFN | EFR32™ Blue Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32FG12P432F1024GL125-B | Energy Micro (Silicon Labs) | FLEX GECKO BGA125 2.4G 19DB PROP | Flex Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 125-VFBGA | - |
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.