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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ATMEGA1281R231-AU | Micrel / Microchip Technology | IC RF TXRX+MCU 802.15.4/ISM QFN | - | -40°C ~ 85°C | - | - | - | - | - | 64-TQFP, 32-QFN | - | |
| AX-SFUS-1-01-TB05 | AMI Semiconductor / ON Semiconductor | UNITED STATES SIGFOX SOC | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 40-VFQFN Exposed Pad | - | |
| EM3587-RT | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 48-VFQFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32MG1P232F256IM32-C0R | Energy Micro (Silicon Labs) | MIGHTY GECKO MESH MULTI-PROTOCOL | Mighty Gecko | -40°C ~ 85°C | - | - | - | - | - | - | - | |
| EFR32FG1V132F256GM48-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM>1GHZ 48-VFQFN | Flex Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EZR32WG230F128R69G-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32WG | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 64-VFQFN Exposed Pad | - | |
| SI4201-GM | Energy Micro (Silicon Labs) | IC RF TXRX CELLULAR 20-VFQFN | Aero™ + | -20°C ~ 85°C | Tube | - | - | - | - | 20-VFQFN Exposed Pad | - | |
| NRF24LE1-O17Q48-T | Nordic Semiconductor | IC RF TXRX+MCU ISM>1GHZ 48-VFQFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32MG12P232F1024GL125-BR | Energy Micro (Silicon Labs) | MIGHTY GECKO BGA125 2.4G 19DB ME | Mighty Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 125-VFBGA | - | |
| JN5148/Z01,515 | NXP Semiconductors / Freescale | IC RF TXRX+MCU 802.15.4 56-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 56-VFQFN Exposed Pad | - |
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.