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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MAX2511EEI+ | Maxim Integrated | IC RF TXRX ISM<1GHZ 28-SSOP | - | -40°C ~ 85°C | Tube | - | - | - | - | 28-SSOP (0.154", 3.90mm Width) | - |
|
SI4463-B1B-FMR | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 20-VFQFN | - | -40°C ~ 85°C | Original-Reel® | - | - | - | - | 20-VFQFN Exposed Pad | - |
|
NRF24LU1P-F32Q32-T | Nordic Semiconductor | IC RF TXRX+MCU ISM>1GHZ 32-VFQFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 32-VFQFN Exposed Pad | - |
|
EFR32FG13P232F512GM32-C | Energy Micro (Silicon Labs) | FLEX GECKO QFN32 2.4G 19DB PROPR | Flex Gecko | -40°C ~ 85°C | - | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
EZR32WG230F64R55G-B0 | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32WG | -40°C ~ 85°C | Tray | - | - | - | - | 64-VFQFN Exposed Pad | - |
|
|
EFR32BG1P233F256GM48-C0R | Energy Micro (Silicon Labs) | BLUE GECKO PREMIUM, DUAL-BAND, 2 | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - |
|
SI1027-B-GMR | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 85-VFLGA | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 85-VFLGA Exposed Pad | - |
|
|
CC1100ERGPT | N/A | IC RF TXRX ISM<1GHZ 20-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 20-VFQFN Exposed Pad | - |
|
EFR32MG1B232F256GM32-C0 | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 32-QFN | - | -40°C ~ 85°C | Tray | - | - | - | - | 32-VFQFN Exposed Pad | - |
|
ADR7023-JBCPZ-RL | ADI (Analog Devices, Inc.) | IC RF TXRX ISM<1GHZ 32-WFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-WFQFN Exposed Pad, CSP | - |
About RF Transceiver ICs
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.