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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CC1110F16RHHT | N/A | IC RF TXRX+MCU ISM<1GHZ 36-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 36-VFQFN Exposed Pad | - | |
| EFR32BG14P632F256GM48-BR | Energy Micro (Silicon Labs) | BLUE PREMIUM QFN48 2.4G 10.5DB B | - | - | - | - | - | - | - | - | - | |
| EFR32FG14P232F128GM48-BR | Energy Micro (Silicon Labs) | FLEX PREMIUM QFN48 2.4G 19.5DB P | - | - | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| ADF7030-1BCPZN | ADI (Analog Devices, Inc.) | SUB GHZ ISM BAND TRANSCEIVER | - | -40°C ~ 85°C | Tray | - | - | - | - | 40-WFQFN Exposed Pad, CSP | ADF7030 | |
| EFR32FG1V132F64GM48-B0 | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM>1GHZ 48-VFQFN | Flex Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EZR32WG230F64R63G-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 64-VFQFN | EZR32WG | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 64-VFQFN Exposed Pad | - | |
| NRF24LE1-F16Q32-R7 | Nordic Semiconductor | IC RF TXRX+MCU ISM>1GHZ 32-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-VFQFN Exposed Pad | - | |
| ATSAMR21E18A-MFT | Micrel / Microchip Technology | IC RF TXRX+MCU ISM>1GHZ 32-VFQFN | SMART™ SAM R21 | -40°C ~ 125°C | Tape & Reel (TR) | - | - | - | - | 32-VFQFN Exposed Pad | - | |
| CC2420RTCR | N/A | IC RF TXRX 802.15.4 48-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EM3582-RTR | Energy Micro (Silicon Labs) | IC RF TXRX+MCU 802.15.4 48-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - |
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.