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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Output Type | Sensor Type | Package / Case | Base Part Number |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EFR32BG1V132F128GM48-B0R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU BLUETOOTH 48QFN | EFR32™ Blue Gecko | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| EFR32FG12P432F1024GL125-B | Energy Micro (Silicon Labs) | FLEX GECKO BGA125 2.4G 19DB PROP | Flex Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 125-VFBGA | - | |
| ATMEGA644PR231-MU | Micrel / Microchip Technology | IC RF TXRX+MCU 802.15.4/ISM | - | -40°C ~ 85°C | Tray | - | - | - | - | 44-QFN, 32-QFN | - | |
| CYBL10162-56LQXIT | Cypress Semiconductor | IC RF TXRX+MCU BLUETOOTH 56QFN | - | -40°C ~ 105°C | Tape & Reel (TR) | - | - | - | - | 56-UFQFN Exposed Pad | - | |
| MKW01Z128CHN | NXP Semiconductors / Freescale | IC RF TXRX+MCU ISM<1GHZ 60-VFLGA | - | -40°C ~ 85°C | Tray | - | - | - | - | 60-VFLGA Exposed Pad | - | |
| NRF24LE1-O17Q32-R7 | Nordic Semiconductor | IC RF TXRX+MCU ISM>1GHZ 32-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-VFQFN Exposed Pad | - | |
| EFR32FG12P232F1024GM48-B | Energy Micro (Silicon Labs) | FLEX GECKO QFN48 2.4G 19DB PROPR | Flex Gecko | -40°C ~ 85°C | Tray | - | - | - | - | 48-VFQFN Exposed Pad | - | |
| NRF905-REEL | Nordic Semiconductor | IC RF TXRX ISM<1GHZ 32-VFQFN | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 32-VFQFN Exposed Pad | - | |
| SI1001-E-GM2R | Energy Micro (Silicon Labs) | IC RF TXRX+MCU ISM<1GHZ 42-VFLGA | - | -40°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 42-VFLGA Exposed Pad | - | |
| BGW200EG/01,515 | NXP Semiconductors / Freescale | IC RF TXRX+MCU WIFI 68-LFLGA | - | -30°C ~ 85°C | Tape & Reel (TR) | - | - | - | - | 68-LFLGA Exposed Pad | - |
RF transceiver ICs, or radio frequency transceiver integrated circuits, are complex semiconductor devices designed to transmit and receive radio frequency signals in electronic systems. These ICs integrate various components such as RF amplifiers, mixers, filters, modulators, demodulators, and frequency synthesizers onto a single chip. RF transceiver ICs are widely used in wireless communication systems, including Wi-Fi, Bluetooth, cellular, and satellite communication devices. They enable wireless data transmission, voice communication, and networking by efficiently handling the modulation, demodulation, and signal processing tasks required for radio communication. RF transceiver ICs offer compactness, low power consumption, and high performance, making them essential components in modern wireless devices and IoT (Internet of Things) applications.