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Memory

Memory

  1. Products
  2. Integrated Circuits (ICs)
  3. Memory
Manufacturer
Series
Operating Temperature
Packaging
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Manufacturer Part Number
Voltage - Supply
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Polarization

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Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Voltage - Supply Shell Style Package / Case Polarization
S29PL032J70BAI120 Cypress Semiconductor IC FLASH 32M PARALLEL 48FBGA PL-J -40°C ~ 85°C (TA) Tray - - 2.7 V ~ 3.6 V - 48-VFBGA -
RMLV0408EGSP-4S2#CA0 Renesas Electronics America IC SRAM 4MBIT 45NS 32SOP - -40°C ~ 85°C (TA) - Tube RMLV0408EGSP-4S2#CA0 - 2.7 V ~ 3.6 V - 32-SOIC (0.450", 11.40mm Width)
CY14V101LA-BA25XI 4D Systems IC NVSRAM 1MBIT 25NS 48FBGA - -40°C ~ 85°C (TA) - Tray CY14V101LA-BA25XI - 2.7 V ~ 3.6 V - 48-TFBGA
S29GL02GS12TFSR20 Cypress Semiconductor IC FLASH 2M PARALLEL GL-S 0°C ~ 85°C (TA) - - - 2.7 V ~ 3.6 V - - -
7006L15PFI8 IDT (Integrated Device Technology) IC SRAM 128K PARALLEL 64TQFP - -40°C ~ 85°C (TA) Tape & Reel (TR) - - 4.5 V ~ 5.5 V - 64-LQFP -
24AA01/W15K Micrel / Microchip Technology IC EEPROM 1K I2C 400KHZ WAFER - 0°C ~ 70°C (TA) Tray - - 1.7 V ~ 5.5 V - Die -
CG8099AAT Cypress Semiconductor IC SRAM SYNC 100TQFP - - - - - - - - -
MTFC64GAPALBH-AIT ES Micron Technology IC FLASH 512G MMC e•MMC™ -40°C ~ 85°C (TA) - - - - - - -
MT29C1G12MAAJVAKC-5 IT TR Micron Technology MCP 64MX16/32MX16 PLASTIC GREEN - - Tape & Reel (TR) - - - - - -
MT40A256M16GE-062E:B Micron Technology IC DRAM 4G PARALLEL 96FBGA - 0°C ~ 95°C (TC) Tray - - 1.14 V ~ 1.26 V - 96-TFBGA -

About Memory


Memory devices encompass a broad category of integrated circuits used to store and retrieve digital data in electronic systems. This includes volatile memory types like random-access memory (RAM) and non-volatile memory types like read-only memory (ROM), flash memory, and various types of storage devices such as hard disk drives and solid-state drives. Memory plays a critical role in data processing, storage, and retrieval across a wide range of electronic devices and applications, from computers and smartphones to embedded systems and IoT devices.