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Memory

Memory

  1. Products
  2. Integrated Circuits (ICs)
  3. Memory
Manufacturer
Series
Operating Temperature
Packaging
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Manufacturer Part Number
Voltage - Supply
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Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Voltage - Supply Shell Style Package / Case Polarization
BR25320N-10SU-2.7 LAPIS Semiconductor IC EEPROM 32K SPI 3MHZ 8SOIC - -40°C ~ 85°C (TA) Tape & Reel (TR) - - 2.7 V ~ 5.5 V - 8-SOIC (0.154", 3.90mm Width) -
MX25L12845GM2I-08G Macronix IC FLASH 128MBIT - - - - - - - - -
CYD09S72V18-250BBXC Cypress Semiconductor IC SRAM 9M PARALLEL 256FBGA - 0°C ~ 70°C (TA) Tray - - 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V - 256-LBGA -
MTFC32GAKAEJP-4M IT Micron Technology IC FLASH 256G MMC e•MMC™ -40°C ~ 85°C (TA) - - - - - - -
24AA16/P Micrel / Microchip Technology IC EEPROM 16K I2C 400KHZ 8DIP - 0°C ~ 70°C (TA) Tube - - 1.7 V ~ 5.5 V - 8-DIP (0.300", 7.62mm) -
W632GU8KT-12 Winbond Electronics Corporation IC DRAM 2G PARALLEL 800MHZ - 0°C ~ 95°C (TC) Tray - - 1.283 V ~ 1.45 V - 78-VFBGA -
CY7C1061AV33-10BAC Cypress Semiconductor IC SRAM 16M PARALLEL 60FBGA - 0°C ~ 70°C (TA) Tray - - 3 V ~ 3.6 V - 60-TFBGA -
MT46H256M32L4LE-48 WT:C TR Micron Technology IC DRAM 8G PARALLEL 168TFBGA - -25°C ~ 85°C (TA) Tape & Reel (TR) - - 1.7 V ~ 1.95 V - 168-TBGA -
S29WS128N0LBFW010 Cypress Semiconductor IC MEMORY NOR - - - - - - - - -
CY62136FV30LL-55ZSXET Cypress Semiconductor IC SRAM 2M PARALLEL 44TSOP II MoBL® -40°C ~ 125°C (TA) Tape & Reel (TR) - - 2 V ~ 3.6 V - 44-TSOP (0.400", 10.16mm Width) -

About Memory


Memory devices encompass a broad category of integrated circuits used to store and retrieve digital data in electronic systems. This includes volatile memory types like random-access memory (RAM) and non-volatile memory types like read-only memory (ROM), flash memory, and various types of storage devices such as hard disk drives and solid-state drives. Memory plays a critical role in data processing, storage, and retrieval across a wide range of electronic devices and applications, from computers and smartphones to embedded systems and IoT devices.