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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | RoHS Status | Manufacturer Part Number | Voltage - Supply | Shell Style | Package / Case | Polarization |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
24FC1025T-I/SM | Micrel / Microchip Technology | IC EEPROM 1M I2C 1MHZ 8SOIJ | - | -40°C ~ 85°C (TA) | Cut Tape (CT) | - | - | 1.8 V ~ 5.5 V | - | 8-SOIC (0.209", 5.30mm Width) | - |
|
IDT71V3558SA133BQ8 | IDT (Integrated Device Technology) | IC SRAM 4.5M PARALLEL 165CABGA | - | 0°C ~ 70°C (TA) | Tape & Reel (TR) | - | - | 3.135 V ~ 3.465 V | - | 165-TBGA | - |
|
AS4C128M8D3B-12BAN | Alliance Memory, Inc. | IC DRAM 1G PARALLEL 78FBGA | Automotive, AEC-Q100 | -40°C ~ 105°C (TC) | Tray | - | - | 1.425 V ~ 1.575 V | - | 78-VFBGA | - |
|
IS42S32160D-6BI | ISSI (Integrated Silicon Solution, Inc.) | IC DRAM 512M PARALLEL 90TFBGA | - | -40°C ~ 85°C (TA) | Tray | - | - | 3 V ~ 3.6 V | - | 90-TFBGA | - |
|
AT28C010-12PU | Micrel / Microchip Technology | IC EEPROM 1M PARALLEL 32DIP | - | -40°C ~ 85°C (TC) | Tube | - | - | 4.5 V ~ 5.5 V | - | 32-DIP (0.600", 15.24mm) | - |
|
AS4C16M16SA-6TCNTR | Alliance Memory, Inc. | IC DRAM 256M PARALLEL 54TSOP | - | 0°C ~ 70°C (TA) | Tape & Reel (TR) | - | - | 3 V ~ 3.6 V | - | 54-TSOP (0.400", 10.16mm Width) | - |
|
IDT70T3399S133DDI | IDT (Integrated Device Technology) | IC SRAM 2M PARALLEL 144TQFP | - | -40°C ~ 85°C (TA) | Tray | - | - | 2.4 V ~ 2.6 V | - | 144-LQFP Exposed Pad | - |
|
|
7052S30GB | IDT (Integrated Device Technology) | IC SRAM 16K PARALLEL 108PGA | - | -55°C ~ 125°C (TA) | Tray | - | - | 4.5 V ~ 5.5 V | - | 108-BPGA | - |
|
AT49F002NT-12TI | Micrel / Microchip Technology | IC FLASH 2M PARALLEL 32TSOP | - | -40°C ~ 85°C (TC) | Tray | - | - | 4.5 V ~ 5.5 V | - | 32-TFSOP (0.724", 18.40mm Width) | - |
|
MT28FW512ABA1LJS-0AAT | Micron Technology | IC FLASH 512M PARALLEL 56TSOP | Automotive, AEC-Q100 | -40°C ~ 105°C (TA) | - | - | - | 1.7 V ~ 3.6 V | - | 56-TFSOP (0.724", 18.40mm Width) | - |
About Memory
Memory devices encompass a broad category of integrated circuits used to store and retrieve digital data in electronic systems. This includes volatile memory types like random-access memory (RAM) and non-volatile memory types like read-only memory (ROM), flash memory, and various types of storage devices such as hard disk drives and solid-state drives. Memory plays a critical role in data processing, storage, and retrieval across a wide range of electronic devices and applications, from computers and smartphones to embedded systems and IoT devices.