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Memory

Memory

  1. Products
  2. Integrated Circuits (ICs)
  3. Memory
Manufacturer
Series
Operating Temperature
Packaging
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Manufacturer Part Number
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Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Voltage - Supply Shell Style Package / Case Polarization
MT40A256M16GE-083E AAT:B TR Micron Technology IC DRAM 4G PARALLEL 1.2GHZ - -40°C ~ 105°C (TC) Tape & Reel (TR) - - 1.14 V ~ 1.26 V - - -
S72XS256RE0AHBH23 Cypress Semiconductor IC FLASH RAM 256MIT PARALLEL XS-R -40°C ~ 85°C (TA) - - - 1.7 V ~ 1.95 V - - -
93LC76C/S15K Micrel / Microchip Technology IC EEPROM 8K SPI 3MHZ WAFER - 0°C ~ 70°C (TA) Tray - - 2.5 V ~ 5.5 V - Die -
MT29F32G08CFACAWP:C TR Micron Technology IC FLASH 32G PARALLEL 48TSOP I - - Tape & Reel (TR) - - - - - -
MTFC64GAJAEDN-AIT Micron Technology IC FLASH 512G MMC e•MMC™ -40°C ~ 85°C (TA) - - - - - - -
BR24G01-3A LAPIS Semiconductor IC EEPROM 1K I2C 1MHZ 8-DIP-T - -40°C ~ 85°C (TA) Tube - - 1.6 V ~ 5.5 V - 8-DIP (0.300", 7.62mm) -
MT53D768M64D8SQ-053 WT ES:E Micron Technology IC DRAM 48G 1866MHZ FBGA - -30°C ~ 85°C (TC) - - - 1.1V - - -
S25FL127SABMFV100 4D Systems IC FLASH 128MBIT 108MHZ 8SOIC FL-S -40°C ~ 105°C (TA) - Tray S25FL127SABMFV100 - 2.7 V ~ 3.6 V - 8-SOIC (0.209", 5.30mm Width)
W948D6KBHX5E TR Winbond Electronics Corporation IC SDRAM 256MBIT 46NM 60BGA - - Tape & Reel (TR) - - - - - -
MT53D768M64D8NZ-046 WT ES:E TR Micron Technology IC DRAM 48G 2133MHZ FBGA - -30°C ~ 85°C (TC) Tape & Reel (TR) - - 1.1V - - -

About Memory


Memory devices encompass a broad category of integrated circuits used to store and retrieve digital data in electronic systems. This includes volatile memory types like random-access memory (RAM) and non-volatile memory types like read-only memory (ROM), flash memory, and various types of storage devices such as hard disk drives and solid-state drives. Memory plays a critical role in data processing, storage, and retrieval across a wide range of electronic devices and applications, from computers and smartphones to embedded systems and IoT devices.