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Memory

Memory

  1. Products
  2. Integrated Circuits (ICs)
  3. Memory
Manufacturer
Series
Operating Temperature
Packaging
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Manufacturer Part Number
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Image Part Number Manufacturer Description Series Operating Temperature Packaging RoHS Status Manufacturer Part Number Voltage - Supply Shell Style Package / Case Polarization
MTFC32GLUDI-WT Micron Technology IC FLASH 256G MMC 169TFBGA e•MMC™ -25°C ~ 85°C (TA) Tray - - 2.7 V ~ 3.6 V - - -
R1LP5256ESP-5SI#B0 Renesas Electronics America IC SRAM 256KBIT 55NS 28SOP - -40°C ~ 85°C (TA) - Tube R1LP5256ESP-5SI#B0 - 4.5 V ~ 5.5 V - 28-SOIC (0.330", 8.38mm Width)
PSD835G2-90UI STMicroelectronics IC FLASH 4M PARALLEL 80LQFP - -40°C ~ 85°C (TA) Tray - - 4.5 V ~ 5.5 V - 80-LQFP -
MTFC8GACAANA-4M IT Micron Technology IC FLASH EMMC 64G - - - - - - - - -
MT53B512M64D4NK-062 WT:B TR Micron Technology IC DRAM 32G 1600MHZ FBGA - -30°C ~ 85°C (TC) Tape & Reel (TR) - - 1.1V - - -
MX68GL1G0GHT2I-10G Macronix IC FLASH 1GBIT - - - - - - - - -
M29W160EB70N3F Micron Technology IC FLASH 16M PARALLEL 48TSOP - -40°C ~ 125°C (TA) - - - 2.7 V ~ 3.6 V - 48-TFSOP (0.724", 18.40mm Width) -
AT29C1024-15JI Micrel / Microchip Technology IC FLASH 1M PARALLEL 44PLCC - -40°C ~ 85°C (TC) Tube - - 4.5 V ~ 5.5 V - 44-LCC (J-Lead) -
AT93C86-10PC-2.7 Micrel / Microchip Technology IC EEPROM 16K SPI 2MHZ 8DIP - 0°C ~ 70°C (TA) Tube - - 2.7 V ~ 5.5 V - 8-DIP (0.300", 7.62mm) -
AT25DF081A-MH-Y Adesto Technologies IC FLASH 8M SPI 100MHZ 8UDFN - -40°C ~ 85°C (TC) Tray - - 2.7 V ~ 3.6 V - 8-UDFN Exposed Pad -

About Memory


Memory devices encompass a broad category of integrated circuits used to store and retrieve digital data in electronic systems. This includes volatile memory types like random-access memory (RAM) and non-volatile memory types like read-only memory (ROM), flash memory, and various types of storage devices such as hard disk drives and solid-state drives. Memory plays a critical role in data processing, storage, and retrieval across a wide range of electronic devices and applications, from computers and smartphones to embedded systems and IoT devices.