• info@zenkaeurope.com
  • English
    English
    Deutsch
    Français
    Español
    Italiano
    中文
    हिन्दी
    Lietuviškai

Logic - FIFOs Memory

Logic - FIFOs Memory

  1. Products
  2. Integrated Circuits (ICs)
  3. Logic - FIFOs Memory
Manufacturer
Series
Operating Temperature
Packaging
Mounting Type
Voltage - Supply

Clear Filters

Loading products…

Image Part Number Manufacturer Description Series Operating Temperature Packaging Mounting Type RoHS Status Manufacturer Part Number Type Voltage - Supply Output
72421L25J IDT (Integrated Device Technology) IC FIFO 64X9 SYNC 25NS 32-PLCC 7200 0°C ~ 70°C Tube Surface Mount - - - 4.5V ~ 5.5V -
SN74V3650-6PEU N/A IC 2048X36 FIFO MEMORY 128LQFP 74V 0°C ~ 70°C Tray Surface Mount - - - 3.15V ~ 3.45V -
72251L10PF8 IDT (Integrated Device Technology) IC FIFO SYNC 512X9 10NS 32QFP 7200 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - 4.5V ~ 5.5V -
SN74ACT7814-40DL N/A IC STROBED FIFO 64X18 56-SSOP 74ACT 0°C ~ 70°C Tube Surface Mount - - - 4.5V ~ 5.5V -
SN74ABT7819A-15PH N/A IC SYNC FIFO MEM 512X18X2 80-QFP 74ABT 0°C ~ 70°C Tray Surface Mount - - - 4.5V ~ 5.5V -
72V293L10PFI IDT (Integrated Device Technology) IC FIFO 65536X18 10NS 80QFP 72V -40°C ~ 85°C Tray Surface Mount - - - 3.15V ~ 3.45V -
72V110163L10PF IDT (Integrated Device Technology) IC FIFO QFP - - - - - - - - -
72V281L10PFG8 IDT (Integrated Device Technology) IC FIFO 32768X18 10NS 64QFP 72V 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - 3V ~ 3.6V -
72V04L15JG8 IDT (Integrated Device Technology) IC FIFO ASYNCH 4KX9 15NS 32PLCC 72V 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - 3V ~ 3.6V -
CY7C425-15JXCT Cypress Semiconductor IC ASYNC FIFO MEM 1KX9 32-PLCC CY7C 0°C ~ 70°C Tape & Reel (TR) Surface Mount - - - 4.5V ~ 5.5V -

About Logic - FIFOs Memory


FIFOs (First-In-First-Out) memory is a type of data storage device used to buffer data in digital systems. It stores data in a sequential manner, with the first data element written into the memory being the first to be read out. FIFOs help manage data flow between subsystems operating at different speeds or with asynchronous timing requirements. They are commonly used in communication interfaces, data processing systems, and digital signal processing applications to manage data transfer and mitigate timing issues.