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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Voltage - Supply | Output | Shell Style |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 89H64H16G2ZCBLI | IDT (Integrated Device Technology) | IC PCI SW 64LANE 16PORT 1156BGA | - | - | - | - | - | - | 3.3V | - | - | |
| 89H32NT8BG2ZBHLI8 | IDT (Integrated Device Technology) | IC PCI SW 32LANE 8PORT 484BGA | - | - | Tape & Reel (TR) | Surface Mount | - | - | 3.3V | - | - | |
| 89HPES24N3A2ZCBXGI | IDT (Integrated Device Technology) | IC PCI SW 24LANE 3PORT 420SBGA | PRECISE™ | - | - | - | - | - | 3.3V | - | - | |
| 89H48H12G3YCHL8 | IDT (Integrated Device Technology) | IC PCI SW 48LANE 12PORT 676BGA | - | - | - | - | - | - | - | - | - | |
| MCZ33905CS3EK | NXP Semiconductors / Freescale | IC SBC CAN HS 3.3V 32SOIC | - | - | Tube | Surface Mount | - | - | 5.5 V ~ 28 V | - | - | |
| MAX1562HESA+T | Maxim Integrated | IC CURR-LIM SW SNGL PROG 8-SOIC | - | - | Tape & Reel (TR) | Surface Mount | - | - | 4 V ~ 5.5 V | - | - | |
| STDVE103ABTY | STMicroelectronics | IC EQUALIZER TMDS/HDMI 64-TQFP | - | - | Tray | Surface Mount | - | - | 3.3V, 5V | - | - | |
| AS8530-ASOM | ams | IC TXRX LIN COMPANION 8-SOIC | - | - | Tape & Reel (TR) | Surface Mount | - | - | 3.135 V ~ 3.465 V | - | - | |
| CS82C59A | Intersil | IC INTERRUPTER CMOS 8MHZ 28-PLCC | - | - | Tube | Surface Mount | - | - | 4.5 V ~ 5.5 V | - | - | |
| MCZ33905DS5EK | NXP Semiconductors / Freescale | SYSTEM BASIS CHIP LIN 2X 5.0 V | - | - | - | - | - | - | 5.5 V ~ 28 V | - | - |
Specialized interfaces refer to custom-designed or application-specific communication interfaces tailored to unique requirements or niche markets. These interfaces may incorporate proprietary protocols, hardware configurations, or software algorithms optimized for specific applications in industries such as aerospace, automotive, medical, and industrial automation. Specialized interfaces often provide enhanced performance, reliability, and integration capabilities compared to standard communication interfaces, enabling seamless interoperability and efficient data exchange between different subsystems, sensors, actuators, and control units in complex electronic systems.