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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Voltage - Supply | Output | Shell Style |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MAX3786UTJ+ | Maxim Integrated | IC BOARD EQUALIZER 1.5GBPS 32QFN | - | - | Tube | Surface Mount | - | - | 3.3V | - | - | |
| MC100EP446MNG | AMI Semiconductor / ON Semiconductor | IC CONV PAR/SER 8BIT DIFF 32-QFN | - | - | Tube | Surface Mount | - | - | 3 V ~ 5.5 V | - | - | |
| UJA1078ATW/3V3,112 | NXP Semiconductors / Freescale | IC SBC CAN/LIN 3.3V HS 32HTSSOP | - | - | Tube | Surface Mount | - | - | 4.5 V ~ 28 V | - | - | |
| MC33389CDH | NXP Semiconductors / Freescale | IC SYSTEM BASIS W/CAN 20-HSOP | - | - | Tube | Surface Mount | - | - | 5 V ~ 18 V | - | - | |
| 89HPES33H13ZABR | IDT (Integrated Device Technology) | IC INTERFACE | - | - | - | - | - | - | - | - | - | |
| PCA9546ADGVR | N/A | IC I2C SMBUS SWITCH 4CH 16-TVSOP | - | - | Tape & Reel (TR) | Surface Mount | - | - | 2.3 V ~ 5.5 V | - | - | |
| DS8023-RJX+T&R | Maxim Integrated | IC SMART CARD 28TSSOP | - | - | Tape & Reel (TR) | Surface Mount | - | - | 2.7 V ~ 6 V | - | - | |
| TDA8037T/C1Y | NXP Semiconductors / Freescale | IC SMART CARD 28SOIC | - | - | Tape & Reel (TR) | Surface Mount | - | - | 3.3V | - | - | |
| PCI2060GHK | N/A | IC PCI-PCI BRIDGE 32-BIT 257-BGA | - | - | Tray | Surface Mount | - | - | 3 V ~ 3.6 V | - | - | |
| LIF-UC140-CM81ITR1K | Lattice Semiconductor | IC USB TYPE C SOLUTION 81BGA | - | - | Tape & Reel (TR) | Surface Mount | - | - | 1.14 V ~ 1.26 V | - | - |
Specialized interfaces refer to custom-designed or application-specific communication interfaces tailored to unique requirements or niche markets. These interfaces may incorporate proprietary protocols, hardware configurations, or software algorithms optimized for specific applications in industries such as aerospace, automotive, medical, and industrial automation. Specialized interfaces often provide enhanced performance, reliability, and integration capabilities compared to standard communication interfaces, enabling seamless interoperability and efficient data exchange between different subsystems, sensors, actuators, and control units in complex electronic systems.