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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Voltage - Supply | Output | Shell Style |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TSI382A-66CQY | IDT (Integrated Device Technology) | IC PCI-X1 PCI EXPR BRIDGE 176QFP | Tsi382™ | - | Tray | Surface Mount | - | - | 3.3V | - | - | |
| USB2660-JZX | Micrel / Microchip Technology | IC CONTROLLER USB 2.0 64QFN | - | - | Tray | Surface Mount | - | - | 3.3V | - | - | |
| SY100E445JZ-TR | Micrel / Microchip Technology | IC CONV 4BIT SER/PAR 28-PLCC | - | - | Tape & Reel (TR) | Surface Mount | - | - | - | - | - | |
| CYV15G0100EQ-SXC | Cypress Semiconductor | IC CABLE EQUALIZER 16SOIC | - | - | Tube | Surface Mount | - | - | 3.135 V ~ 3.465 V | - | - | |
| AD9883AKSTZ-110 | ADI (Analog Devices, Inc.) | IC FLAT PANEL INTERFACE 80-LQFP | - | - | Tray | Surface Mount | - | - | 3 V ~ 3.6 V | - | - | |
| PCI2250PCM | N/A | IC PCI-PCI BRIDGE 32-BIT 160-QFP | - | - | Tray | Surface Mount | - | - | 3 V ~ 3.6 V | - | - | |
| XIO2001ZAJ | N/A | IC PCI-EXPRESS BRIDGE 144-BGA | - | - | Tray | Surface Mount | - | - | 1.35 V ~ 1.65 V, 3 V ~ 3.6 V | - | - | |
| Z84C4206PEC | Zilog | IC 6MHZ Z80 CMOS SIO/2 40-DIP | Z80 | - | - | Through Hole | - | - | 5V | - | - | |
| DS90CF384AMTDX/NOPB | N/A | IC RVR LVDS FPD 3.3V 56-TSSOP | - | - | Cut Tape (CT) | Surface Mount | - | - | 3 V ~ 3.6 V | - | - | |
| DS90CF384AMTD/NOPB | N/A | IC RCVR LVDS FPD 24BIT 56-TSSOP | - | - | Tube | Surface Mount | - | - | 3 V ~ 3.6 V | - | - |
Specialized interfaces refer to custom-designed or application-specific communication interfaces tailored to unique requirements or niche markets. These interfaces may incorporate proprietary protocols, hardware configurations, or software algorithms optimized for specific applications in industries such as aerospace, automotive, medical, and industrial automation. Specialized interfaces often provide enhanced performance, reliability, and integration capabilities compared to standard communication interfaces, enabling seamless interoperability and efficient data exchange between different subsystems, sensors, actuators, and control units in complex electronic systems.