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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Voltage - Supply | Output | Shell Style |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TMDS442PNP | N/A | IC DVI/HDMI SW 4-TO-2 128-HTQFP | - | - | Tray | Surface Mount | - | - | 3 V ~ 3.6 V | - | - | |
| ADP5589ACPZ-01-R7 | ADI (Analog Devices, Inc.) | IC KEY DECODER 19I/O EXP 24LFCSP | - | - | Tape & Reel (TR) | Surface Mount | - | - | 1.65 V ~ 3.6 V | - | - | |
| DS90CF583MTD/NOPB | N/A | IC TXRX LVDS FPD 24BIT 56-TSSOP | - | - | Tube | Surface Mount | - | - | 4.75 V ~ 5.25 V | - | - | |
| PX1011B-EL1/G,551 | NXP Semiconductors / Freescale | IC PCI-EXPRESS X1 PHY 81-LFBGA | - | - | Tray | Surface Mount | - | - | 1.2V | - | - | |
| DS90C363BMT/NOPB | N/A | IC FPD-LINK 3.3V 18B TX 48-TSSOP | - | - | Tube | Surface Mount | - | - | 3 V ~ 3.6 V | - | - | |
| 87200FG/K1 | Nuvoton Technology Corporation America | IC BRIDGE PCI TO ISA 160QFP | - | - | Tube | Surface Mount | - | - | 3 V ~ 3.6 V | - | - | |
| DS90CF562MTD/NOPB | N/A | IC RCVR LVDS FPD 18BIT 48-TSSOP | - | - | Tube | Surface Mount | - | - | 4.5 V ~ 5.5 V | - | - | |
| 89H12NT12G2ZCHLI | IDT (Integrated Device Technology) | IC PCI SW 12LANE 12PORT 324BGA | - | - | Tray | Surface Mount | - | - | 3.3V | - | - | |
| TPFLXIC006 | Micrel / Microchip Technology | IC USB TO ASYNC UART INTERFACE | - | - | Bulk | Surface Mount | - | - | 3.3 V ~ 5 V | - | - | |
| LM4308SQX/NOPB | N/A | IC CPU DISPLAT 18BIT 40WQFN | - | - | Tape & Reel (TR) | Surface Mount | - | - | 1.6 V ~ 3 V | - | - |
Specialized interfaces refer to custom-designed or application-specific communication interfaces tailored to unique requirements or niche markets. These interfaces may incorporate proprietary protocols, hardware configurations, or software algorithms optimized for specific applications in industries such as aerospace, automotive, medical, and industrial automation. Specialized interfaces often provide enhanced performance, reliability, and integration capabilities compared to standard communication interfaces, enabling seamless interoperability and efficient data exchange between different subsystems, sensors, actuators, and control units in complex electronic systems.