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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Voltage - Supply | Output | Shell Style |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MCZ33989EGR2 | NXP Semiconductors / Freescale | IC SYSTEM BASIS CHIP CAN 28-SOIC | - | - | Tape & Reel (TR) | Surface Mount | - | - | 5.5 V ~ 18 V | - | - | |
| Z84C4208PEC | Zilog | IC I/O CONTROLLER CMOS 40DIP | Z80 | - | Tube | Through Hole | - | - | 5V | - | - | |
| MCZ33905D5EK | NXP Semiconductors / Freescale | IC SBC CAN/LIN 5.0V HS DL 54SOIC | - | - | Tube | Surface Mount | - | - | 5.5 V ~ 28 V | - | - | |
| 89H12NT12G2ZCHL8 | IDT (Integrated Device Technology) | IC PCI SW 12LANE 12PORT 324BGA | - | - | Tape & Reel (TR) | Surface Mount | - | - | 3.3V | - | - | |
| DS32EV100SD/NOPB | N/A | IC EQUALIZER SGL PROGR 14WSON | - | - | Cut Tape (CT) | Surface Mount | - | - | 2.375 V ~ 2.625 V | - | - | |
| CLC014AJE/NOPB | N/A | IC CABLE EQUALIZER ADAPTV 14SOIC | - | - | Tube | Surface Mount | - | - | 4.5 V ~ 5.5 V | - | - | |
| MAX31730AUB+T | Maxim Integrated | IC REMOTE TEMP SENSOR USSOP | - | - | Tape & Reel (TR) | Surface Mount | - | - | 3 V ~ 3.6 V | - | - | |
| SAA1305T/N1,112 | NXP Semiconductors / Freescale | IC ON/OFF LOGIC 24-SOIC | - | - | Tube | Surface Mount | - | - | 4.5 V ~ 5.5 V | - | - | |
| NCT6102D | Nuvoton Technology Corporation America | IC LPC SUPER I/O 128LQFP | - | - | Tray | Surface Mount | - | - | 5V | - | - | |
| Z85C3008VSG | Zilog | IC CONTROLLER CMOS 44PLCC | - | - | Tube | Surface Mount | - | - | 4.5 V ~ 5.5 V | - | - |
Specialized interfaces refer to custom-designed or application-specific communication interfaces tailored to unique requirements or niche markets. These interfaces may incorporate proprietary protocols, hardware configurations, or software algorithms optimized for specific applications in industries such as aerospace, automotive, medical, and industrial automation. Specialized interfaces often provide enhanced performance, reliability, and integration capabilities compared to standard communication interfaces, enabling seamless interoperability and efficient data exchange between different subsystems, sensors, actuators, and control units in complex electronic systems.