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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Packaging | Mounting Type | RoHS Status | Manufacturer Part Number | Voltage - Supply | Output | Shell Style |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TSI382A-66ILV | IDT (Integrated Device Technology) | IC PCI-X1 PCI EXPR BRIDGE 144BGA | Tsi382™ | - | Tray | Surface Mount | - | - | 3.3V | - | - | |
| DS8024-RJX/V+ | Maxim Integrated | IC AFE SMART CARD AUTO 28-TSSOP | Automotive, AEC-Q100 | - | Tube | Surface Mount | - | - | - | - | - | |
| PI3HDMI336FBE | Diodes Incorporated | IC DVI/HDMI MUX/DEMUX 64LQFP | - | - | Tray | Surface Mount | - | - | - | - | - | |
| 89HP0504PZBABGI | IDT (Integrated Device Technology) | IC PCIE SIGNAL REPEATER 100CABGA | - | - | Tray | Surface Mount | - | - | - | - | - | |
| PCI2050PDVG4 | N/A | IC PCI-PCI BRIDGE 32-BIT 208LQFP | - | - | Tray | Surface Mount | - | - | 3 V ~ 3.6 V | - | - | |
| SIO1039-JV | Micrel / Microchip Technology | IC NOTEBOOK I/O CTRLR 64STQFP | - | - | - | - | - | - | - | - | - | |
| XIO2001IPNP | N/A | IC PCI-EXPRSS/BUS BRIDG 128HTQFP | - | - | Tray | Surface Mount | - | - | 1.35 V ~ 1.65 V, 3 V ~ 3.6 V | - | - | |
| MCZ33903C5EKR2 | NXP Semiconductors / Freescale | IC SBC CAN HS 5.0V 32SOIC | - | - | Tape & Reel (TR) | Surface Mount | - | - | 5.5 V ~ 28 V | - | - | |
| 89HMPEB383ZAEM8 | IDT (Integrated Device Technology) | IC PCIE TO PCI BRIDGE 128QFP | - | - | - | - | - | - | - | - | - | |
| 89HPES24T61ZCBXI | IDT (Integrated Device Technology) | IC PCI SW 24LANE 6PORT 420BGA | PRECISE™ | - | - | - | - | - | 3.3V | - | - |
Specialized interfaces refer to custom-designed or application-specific communication interfaces tailored to unique requirements or niche markets. These interfaces may incorporate proprietary protocols, hardware configurations, or software algorithms optimized for specific applications in industries such as aerospace, automotive, medical, and industrial automation. Specialized interfaces often provide enhanced performance, reliability, and integration capabilities compared to standard communication interfaces, enabling seamless interoperability and efficient data exchange between different subsystems, sensors, actuators, and control units in complex electronic systems.