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Interface - Signal Terminators

Interface - Signal Terminators

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  2. Integrated Circuits (ICs)
  3. Interface - Signal Terminators
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Image Part Number Manufacturer Description Series Packaging Mounting Type RoHS Status Manufacturer Part Number Lead Free Status Voltage - Supply Shell Style Package / Case
DS21T05Z+ Maxim Integrated IC TERMINATOR SCSI 16-SOIC - Tube Surface Mount - - - 4 V ~ 5.5 V - 16-SOIC (0.154", 3.90mm Width)
DS2108S/T&R Maxim Integrated IC TERM SCSI DIFF/SWITCH 24-SOIC - Tape & Reel (TR) Surface Mount - - - 4 V ~ 5.25 V - 24-SOIC (0.295", 7.50mm Width)
MXL1344ACAG+ Maxim Integrated IC CABLE TERM MULTIPROTCL 24SSOP - Tube Surface Mount - - - 4.5 V ~ 5.5 V - 24-SSOP (0.209", 5.30mm Width)
Z53C8003VSG Zilog IC SCSI CMOS 48PLCC Z53C80 Tube Surface Mount - - - 4.75 V ~ 5.25 V - 44-LCC (J-Lead)
UCC5672MWP N/A IC SCSI 9-LINE TERM 36-SSOP - Tube Surface Mount - - - 2.7 V ~ 5.25 V - 36-BSOP (0.295", 7.50mm Width)
DS21T07E+ Maxim Integrated IC TERMINATOR SCSI 20-TSSOP - Tube Surface Mount - - - 4 V ~ 5.5 V - 20-TSSOP (0.173", 4.40mm Width)
UCC5629FQPTR N/A IC SCSI 14-LINE TERM 48-LQFP - Tape & Reel (TR) Surface Mount - - - 2.7 V ~ 5.25 V - 48-LQFP
DS2120B/T&R Maxim Integrated IC TERM SCSI ULTRA3 LVD 36-SSOP - Tape & Reel (TR) Surface Mount - - - 2.7 V ~ 5.5 V - 36-BSOP (0.295", 7.50mm Width)
UCC5614PWPG4 N/A IC SCSI 9-LINE TERM 24-TSSOP - Tube Surface Mount - - - 2.7 V ~ 5.25 V - 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
UCC5628FQPG4 N/A IC SCSI 14-LINE TERM 48-LQFP - Tray Surface Mount - - - 2.7 V ~ 5.25 V - 48-LQFP

About Interface - Signal Terminators


Signal terminators are passive electronic components used to terminate signal lines and prevent signal reflections and interference in high-speed digital communication systems. They match the impedance of the transmission line to the impedance of the connected devices, minimizing signal reflections and ensuring clean signal transitions. Signal terminators are commonly used in serial communication interfaces such as USB, Ethernet, LVDS, and HDMI to maintain signal integrity and maximize data transmission rates over long distances and complex interconnection topologies.