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Interface - Signal Terminators

Interface - Signal Terminators

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  2. Integrated Circuits (ICs)
  3. Interface - Signal Terminators
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Image Part Number Manufacturer Description Series Packaging Mounting Type RoHS Status Manufacturer Part Number Lead Free Status Voltage - Supply Shell Style Package / Case
DS21T05S Maxim Integrated IC TERMINATOR SCSI 300MIL 16SOIC - Tube Surface Mount - - - 4 V ~ 5.5 V - 16-SOIC (0.295", 7.50mm Width)
DS21T05Z+T&R Maxim Integrated IC TERMINATOR SCSI 16-SOIC - Tape & Reel (TR) Surface Mount - - - 4 V ~ 5.5 V - 16-SOIC (0.154", 3.90mm Width)
Z53C8003VSC00TR Zilog IC Z53C80 SCSI 44PLCC Z53C80 Tape & Reel (TR) Surface Mount - - - 4.75 V ~ 5.25 V - 44-LCC (J-Lead)
UCC5621MWPTR N/A IC SCSI 27-LINE TERM 44-SSOP - Tape & Reel (TR) Surface Mount - - - - - 44-BSOP (0.295", 7.50mm Width)
UCC5639FQP N/A IC SCSI 15-LINE TERM 48-LQFP - Tray Surface Mount - - - 2.7 V ~ 5.25 V - 48-LQFP
PACUSB-U3R AMI Semiconductor / ON Semiconductor IC USB TERMINATOR 1CHAN SC70-6 - Tape & Reel (TR) Surface Mount - - - 3.3V - 6-TSSOP, SC-88, SOT-363
LX7203-15ISM Microsemi IC USB LINE TERM EMI/ESD SC70-6 - Tube Surface Mount - - - 5.25V - 6-TSSOP, SC-88, SOT-363
DS2125 Maxim Integrated IC TERM SCSI ULT3 LVD/SE 48-LQFP - Tube Surface Mount - - - 2.7 V ~ 5.5 V - 48-LQFP
DS21T09S+ Maxim Integrated IC TERM PLUG/PLAY SCSI 28-SOIC - Tube Surface Mount - - - 4 V ~ 5.5 V - 28-SOIC (0.295", 7.50mm Width)
DS2125+T&R Maxim Integrated IC TERM SCSI ULT3 LVD/SE 48-LQFP - Tape & Reel (TR) Surface Mount - - - 2.7 V ~ 5.5 V - 48-LQFP

About Interface - Signal Terminators


Signal terminators are passive electronic components used to terminate signal lines and prevent signal reflections and interference in high-speed digital communication systems. They match the impedance of the transmission line to the impedance of the connected devices, minimizing signal reflections and ensuring clean signal transitions. Signal terminators are commonly used in serial communication interfaces such as USB, Ethernet, LVDS, and HDMI to maintain signal integrity and maximize data transmission rates over long distances and complex interconnection topologies.