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Interface - Signal Terminators

Interface - Signal Terminators

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  2. Integrated Circuits (ICs)
  3. Interface - Signal Terminators
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Image Part Number Manufacturer Description Series Packaging Mounting Type RoHS Status Manufacturer Part Number Lead Free Status Voltage - Supply Shell Style Package / Case
Z53C8003FSG Zilog IC SCSI CMOS 48LQFP Z53C80 Tray Surface Mount - - - 4.75 V ~ 5.25 V - 48-LQFP
UCC5642MWPTRG4 N/A IC TERMINATOR W/REG SCSI 36-SSOP - Tape & Reel (TR) Surface Mount - - - 2.7 V ~ 5.25 V - 36-BSOP (0.295", 7.50mm Width)
DS21T07E+T&R Maxim Integrated IC TERMINATOR SCSI 20-TSSOP - Tape & Reel (TR) Surface Mount - - - 4 V ~ 5.5 V - 20-TSSOP (0.173", 4.40mm Width)
UCC5630AMWPG4 N/A IC SCSI 9-LINE TERM 36-SSOP - Tube Surface Mount - - - 2.7 V ~ 5.25 V - 36-BSOP (0.295", 7.50mm Width)
UCC5672PWPTR N/A IC SCSI 9-LINE TERM 28-HTSSOP - Tape & Reel (TR) Surface Mount - - - 2.7 V ~ 5.25 V - 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
DS21T07S+ Maxim Integrated IC TERMINATOR SCSI 16-SOIC - Tube Surface Mount - - - 4 V ~ 5.5 V - 16-SOIC (0.295", 7.50mm Width)
UCC5631AFQP N/A IC SCSI 9-LINE TERM 48-LQFP - Tray Surface Mount - - - 2.7 V ~ 5.25 V - 48-LQFP
UCC5640PW28 N/A IC SCSI 9-LINE TERM 28-TSSOP - Tube Surface Mount - - - 2.7 V ~ 5.25 V - 28-TSSOP (0.173", 4.40mm Width)
UCC5642MWPG4 N/A IC TERMINATOR W/REG SCSI 36-SSOP - Tube Surface Mount - - - 2.7 V ~ 5.25 V - 36-BSOP (0.295", 7.50mm Width)
DS2105Z+ Maxim Integrated IC SCSI TERMINATOR 16-SOIC - Tube Surface Mount - - - 4 V ~ 5.25 V - 16-SOIC (0.154", 3.90mm Width)

About Interface - Signal Terminators


Signal terminators are passive electronic components used to terminate signal lines and prevent signal reflections and interference in high-speed digital communication systems. They match the impedance of the transmission line to the impedance of the connected devices, minimizing signal reflections and ensuring clean signal transitions. Signal terminators are commonly used in serial communication interfaces such as USB, Ethernet, LVDS, and HDMI to maintain signal integrity and maximize data transmission rates over long distances and complex interconnection topologies.