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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S010-VF256I Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 256-VFBGA - 256-BGA (17x17) -
XC7Z015-2CLG485E Xilinx IC SOC CORTEX-A9 ARTIX-7 485BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 484-LFBGA, CSPBGA - 485-CSBGA (19x19) -
XCZU9CG-2FFVC900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
XA7Z030-1FBV484Q Xilinx VIRTEX-7 FBGA BLOCK 484BGA Automotive, AEC-Q100, Zynq®-7000 XA -40°C ~ 125°C (TJ) - Tray - 484-BBGA, FCBGA - 484-FCBGA (23x23) -
10AS022E3F29E1HG Intel® FPGAs IC SOC FPGA 288 I/O 780FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -
XCZU7EV-L1FFVC1156I Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EV -40°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -
M2S005S-1TQ144 Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 144-LQFP - 144-TQFP (20x20) -
A2F060M3E-TQG144I Microsemi IC FPGA 60K GATES 128KB 144-TQFP SmartFusion® -40°C ~ 100°C (TJ) - Tray - 144-LQFP A2F060M3E 144-TQFP (20x20) -
10AS027E3F27E2LG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S060T-FCS325I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.