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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S010S-1TQ144I | Microsemi | IC FPGA SOC | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 10AS048E2F29E1SG | Altera (Intel® Programmable Solutions Group) | IC SOC FPGA 360 I/O 780FBGA | Arria 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | 780-BBGA, FCBGA | - | 780-FBGA (29x29) | - | |
| 1SX250LH3F55I2VG | Intel® FPGAs | 2912-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| XCZU25DR-L2FSVG1517I | Xilinx | XCZU25DR-L2FSVG1517I | - | - | - | Tray | - | - | - | - | - | |
| M2S090T-FG484I | Microsemi | IC FPGA SOC 90K LUTS 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| M2S060T-FGG484 | Microsemi | IC FPGA SOC 60K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| 10AS048K2F35I1HG | Intel® FPGAs | IC SOC FPGA 396 I/O 1152FBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | - | 1152-FBGA (35x35) | - | |
| 1SX250LU3F50I3VG | Intel® FPGAs | 2397-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 5CSEBA5U23C8N | Altera (Intel® Programmable Solutions Group) | IC FPGA 145 I/O 672UBGA | Cyclone® V SE | 0°C ~ 85°C (TJ) | - | Tray | - | 672-FBGA | 5CSEBA5 | 672-UBGA (23x23) | - | |
| XCZU5EG-1FBVB900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.