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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S090-1FG484 Microsemi IC FPGA SOC 90K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S090 484-FPBGA (23x23) -
10AS057H4F34E3LG Intel® FPGAs IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
10AS032H2F35I1HG Intel® FPGAs IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
XCZU5CG-1SFVC784E Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
M2S060TS-1VFG400I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
XCZU17EG-2FFVC1760I Xilinx IC FPGA 512 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
XCZU2CG-1SFVA625I Xilinx IC FPGA 180 I/O 625FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -
5ASXMB5G4F40C4N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASXMB5 1517-FBGA (40x40) -
XC7Z030-2SBG485E Xilinx IC SOC CORTEX A-9 ZYNQ7 485BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 484-FBGA - 485-FBGA (19x19) -
XCZU3CG-1SFVA625I Xilinx XCZU3CG-1SFVA625I Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.