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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS027E1F29I1HG Intel® FPGAs IC SOC FPGA 360 I/O 780FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 780-BBGA, FCBGA - 780-FBGA (29x29) -
M2S025-FG484I Microsemi IC FPGA SOC 25K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
M2S150-FCG1152 Microsemi IC FPGA SOC 150K LUTS 1152FCBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA M2S150 1152-FCBGA (35x35) -
1SX250LN3F43E1VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
XCZU6CG-1FFVC900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
M2S005-TQG144I Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 144-LQFP - 144-TQFP (20x20) -
XCZU3EG-1SFVA625E Xilinx IC FPGA 180 I/O 625FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -
10AS027E4F27E3SG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
10AS022E4F29I3SG Intel® FPGAs 780-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
XCZU7EV-L2FFVC1156E Xilinx IC FPGA 360 I/O 1156FCBGA Zynq® UltraScale+™ MPSoC EV 0°C ~ 100°C (TJ) - Tray - 1156-BBGA, FCBGA - 1156-FCBGA (35x35) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.