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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5ASXFB5H4F40C5N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASXFB5 1517-FBGA (40x40) -
XCZU3CG-1SFVC784E Xilinx XCZU3CG-1SFVC784E Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
M2S100-FCG1152 Microsemi IC FPGA SOC 100K LUTS 1152FCBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA M2S100 1152-FCBGA (35x35) -
10AS022E3F29E2SG Intel® FPGAs 780-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
1SX250LH2F55I1VG Intel® FPGAs 2912-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
1SX280LU3F50I1VG Intel® FPGAs 2397-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
XC7Z030-3SBG485E Xilinx IC SOC CORTEX A-9 ZYNQ7 485BGA Zynq®-7000 0°C ~ 100°C (TJ) - Tray - 484-FBGA - 485-FBGA (19x19) -
10AS057K2F35E1HG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
XCZU4CG-2FBVB900I Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC CG -40°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
M2S010TS-1VFG256 Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.