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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
BCM3384EKFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
XCZU7EG-1FFVF1517E Xilinx IC FPGA 464 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
10AS057H3F34I2SG Intel® FPGAs IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
M2S090-FGG484I Microsemi IC FPGA SOC 90K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
M2S050-1FCS325I Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
M2S010-VFG256 Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -
M2S010-VFG400 Microsemi IC FPGA SOC 10K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA M2S010 400-VFBGA (17x17) -
M2S050T-1FGG484I Microsemi IC FPGA SOC 50K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S050T 484-FPBGA (23x23) -
M2S060-VFG400 Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
M2S050-1VFG400 Microsemi IC FPGA SOC 50K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA M2S050 400-VFBGA (17x17) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.