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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5CSEBA2U23C6N Intel® FPGAs IC FPGA 188 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -
M2S150T-1FCVG484 Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BFBGA - 484-BGA -
M2S010-VFG400I Microsemi IC FPGA SOC 10K LUT 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
10AS066K2F35I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
M2S150T-1FCS536 Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 536-LFBGA - 536-BGA (16x16) -
XCZU3EG-2SFVC784I Xilinx IC FPGA 252 I/O 784FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 784-BBGA, FCBGA - 784-FCBGA (23x23) -
10AS027H1F35I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 384 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
M2S090-FG676I Microsemi IC FPGA SOC 90K LUTS 676FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 676-BGA - 676-FBGA (27x27) -
M2S060T-1FCSG325I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
M2S050S-1FGG484I Microsemi IC FPGA SOC 50K LUTS 484FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BGA M2S050S 484-FPBGA (23x23) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.