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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS066K2F40E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
5CSEBA6U23C7SN Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSEBA6 672-UBGA (23x23) -
M2S050-FCS325I Microsemi IC FPGA SOC 50K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
10AS027E2F27I2SG Intel® FPGAs 672-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
10AS066K2F40E2SG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
10AS022E4F27I3LG Intel® FPGAs 672-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
10AS027E3F29I2LG Intel® FPGAs 780-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
10AS066K2F40I2LG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
M2S090TS-1FCS325I Microsemi IC FPGA SOC 90K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 325-TFBGA - 325-BGA (11x11) -
5ASXFB3H4F40I5N Intel® FPGAs IC FPGA 528 I/O 1517FBGA Arria V SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASXFB3 1517-FBGA (40x40) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.