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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z045-1FBG676C | Xilinx | IC SOC CORTEX-A9 KINTEX7 676FBGA | Zynq®-7000 | 0°C ~ 85°C (TJ) | - | Tray | - | 676-BBGA, FCBGA | XC7Z045 | 676-FCBGA (27x27) | - | |
| M2S005S-VF256I | Microsemi | IC FPGA SOC 5K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 256-VFBGA | - | 256-BGA (17x17) | - | |
| M2S050-1FCSG325I | Microsemi | IC FPGA SOC 50K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - | |
| XC7Z045-3FBG676E | Xilinx | IC SOC CORTEX-A9 KINTEX7 676FBGA | Zynq®-7000 | 0°C ~ 100°C (TJ) | - | Tray | - | 676-BBGA, FCBGA | XC7Z045 | 676-FCBGA (27x27) | - | |
| M2S090T-FCS325I | Microsemi | IC FPGA SOC 90K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 325-TFBGA | - | 325-BGA (11x11) | - | |
| XCZU29DR-L2FFVF1760I | Xilinx | XCZU29DR-L2FFVF1760I | - | - | - | Tray | - | - | - | - | - | |
| XC7Z100-2FFG1156I | Xilinx | IC SOC CORTEX A-9 ZYNQ7 1156BGA | Zynq®-7000 | -40°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - | |
| XAZU2EG-1SFVC784Q | Xilinx | XAZU2EG-1SFVC784Q | - | - | - | Tray | - | - | - | - | - | |
| XCZU7CG-2FBVB900I | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC CG | -40°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| M2S100T-1FCG1152I | Microsemi | IC FPGA SOC 100K LUTS 1152FCBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 1152-BBGA, FCBGA | M2S100T | 1152-FCBGA (35x35) | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.