• info@zenkaeurope.com
  • English
    English
    Deutsch
    Français
    Español
    Italiano
    中文
    हिन्दी
    Lietuviškai

Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
Manufacturer
Series
Operating Temperature
Packaging
Package / Case
Base Part Number
Supplier Device Package

Clear Filters

Loading products…

Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
XA7Z020-1CLG484Q Xilinx IC SOC CORTEX A-9 ZYNQ7 484BGA Automotive, AEC-Q100, Zynq®-7000 XA -40°C ~ 125°C (TJ) - Tray - 484-LFBGA, CSPBGA - 484-CSPBGA (19x19) -
10AS032E3F29E2LG Intel® FPGAs 780-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
10AS066K1F35I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
M2S050TS-1VF400 Microsemi IC FPGA SOC 50K LUTS 400VFBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
XCZU4CG-2FBVB900E Xilinx IC FPGA 204 I/O 900FCBGA Zynq® UltraScale+™ MPSoC CG 0°C ~ 100°C (TJ) - Tray - 900-BBGA, FCBGA - 900-FCBGA (31x31) -
M2S060TS-1FG676I Microsemi IC FPGA SOC 60K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 676-BGA - 676-FBGA (27x27) -
M2S050T-1VFG400I Microsemi IC FPGA SOC 50K LUTS 400VFBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 400-LFBGA M2S050T 400-VFBGA (17x17) -
M2S090-1FG676I Microsemi IC FPGA SOC 90K LUTS 676FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 676-BGA M2S090 676-FBGA (27x27) -
XC7Z035-1FBG676I Xilinx IC SOC CORTEX-A9 KINTEX7 676BGA Zynq®-7000 -40°C ~ 100°C (TJ) - Tray - 676-BBGA, FCBGA - 676-FCBGA (27x27) -
5ASXBB3D4F35C4N Intel® FPGAs IC FPGA 350 I/O 1152FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA 5ASXBB3 1152-FBGA (35x35) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.