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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5CSXFC6D6F31C6N Altera (Intel® Programmable Solutions Group) IC FPGA 288 I/O 896FBGA Cyclone® V SX 0°C ~ 85°C (TJ) - Tray - 896-BGA 5CSXFC6 896-FBGA (31x31) -
10AS057N1F40I1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 588 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
10AS027H4F35E3LG Intel® FPGAs 1152-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
10AS066K1F40E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FBGA (40x40) -
10AS032E3F29I2SG Intel® FPGAs 780-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
XCZU3EG-L1SFVA625I Xilinx IC FPGA 180 I/O 625FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -
1SX280LH3F55I1VG Intel® FPGAs 2912-PIN FBGA Stratix® 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -
5CSEMA6U23C8N Intel® FPGAs IC FPGA 145 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA 5CSEMA6 672-UBGA (23x23) -
10AS048H4F34E3SG Intel® FPGAs IC SOC FPGA 492 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
10AS048E4F29I3LG Intel® FPGAs 780-PIN FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - - - - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.