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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
M2S010-VFG256I Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -
10AS057K2F35E1SG Altera (Intel® Programmable Solutions Group) IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
10AS057K2F35I2LG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
M2S150T-FCV484I Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 484-BFBGA - 484-BGA -
10AS057K3F40I2LG Intel® FPGAs IC SOC FPGA 696 I/O 1517FBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
10AS022E4F29E3SG Intel® FPGAs 780-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S060T-1FG484M Microsemi IC FPGA SOC SmartFusion®2 -55°C ~ 125°C (TJ) - Tray - - - - -
5CSXFC4C6U23C7N Intel® FPGAs IC FPGA 188 I/O 672UBGA Cyclone® V SX 0°C ~ 85°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -
M2S010T-1VFG256I Microsemi IC FPGA SOC 10K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -
5CSXFC6D6F31C7N Intel® FPGAs IC FPGA 288 I/O 896FBGA Cyclone® V SX 0°C ~ 85°C (TJ) - Tray - 896-BGA 5CSXFC6 896-FBGA (31x31) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.