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Embedded - System On Chip (SoC)
Embedded - System On Chip (SoC)
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- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
M2S025T-1FGG484 | Microsemi | IC FPGA SOC 25K LUTS 484FBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | M2S025T | 484-FPBGA (23x23) | - |
|
XCZU15EG-L2FFVC900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - |
|
5ASXFB3H4F40C5N | Intel® FPGAs | IC FPGA 528 I/O 1517FBGA | Arria V SX | 0°C ~ 85°C (TJ) | - | Tray | - | 1517-BBGA, FCBGA | 5ASXFB3 | 1517-FBGA (40x40) | - |
|
M2S050S-1FG896I | Microsemi | IC FPGA SOC 50K LUTS 896FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 896-FBGA | M2S050S | 896-FBGA (31x31) | - |
|
|
XC7Z045-2FFG900E | Xilinx | IC SOC CORTEX-A9 KINTEX7 900FBGA | Zynq®-7000 | 0°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | XC7Z045 | 900-FCBGA (31x31) | - |
|
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XCZU3EG-3SFVC784E | Xilinx | IC FPGA 252 I/O 784FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 784-BBGA, FCBGA | - | 784-FCBGA (23x23) | - |
|
|
A2F060M3E-1CS288I | Microsemi | IC FPGA 60K GATES 128KB 288-CSP | SmartFusion® | -40°C ~ 100°C (TJ) | - | Tray | - | 288-TFBGA, CSPBGA | A2F060M3E | 288-CSP (11x11) | - |
|
|
XCZU7EG-3FFVC1156E | Xilinx | IC FPGA 360 I/O 1156FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1156-BBGA, FCBGA | - | 1156-FCBGA (35x35) | - |
|
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1SX250LH2F55I2LG | Intel® FPGAs | 2912-PIN FBGA | Stratix® 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
|
|
M2S025TS-FGG484 | Microsemi | IC FPGA SOC 25K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - |
About Embedded - System On Chip (SoC)
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.