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| Image | Part Number | Manufacturer | Description | Series | Operating Temperature | Features | Packaging | Lead Free Status | Package / Case | Base Part Number | Supplier Device Package | Applications |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| M2S050T-VF400 | Microsemi | IC FPGA SOC 50K LUTS 400VFBGA | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 400-LFBGA | M2S050T | 400-VFBGA (17x17) | - | |
| M2S050T-FGG484I | Microsemi | IC FPGA SOC 50K LUT 484FBGA | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| XCZU19EG-L2FFVE1924E | Xilinx | IC FPGA 668 I/O 1924FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 1924-BBGA, FCBGA | - | 1924-FCBGA (45x45) | - | |
| M2S050TS-FG484I | Microsemi | IC FPGA SOC 50K LUTS | SmartFusion®2 | -40°C ~ 100°C (TJ) | - | Tray | - | 484-BGA | - | 484-FPBGA (23x23) | - | |
| 1SX250LU3F50E2VG | Intel® FPGAs | 2397-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| 1SX280LN2F43E2VGS1 | Intel® FPGAs | 1760-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| XCZU7EG-2FBVB900E | Xilinx | IC FPGA 204 I/O 900FCBGA | Zynq® UltraScale+™ MPSoC EG | 0°C ~ 100°C (TJ) | - | Tray | - | 900-BBGA, FCBGA | - | 900-FCBGA (31x31) | - | |
| 1SX250LU3F50E1VG | Intel® FPGAs | 2397-PIN FBGA | Stratix® 10 SX | 0°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - | |
| M2S010-1TQ144 | Microsemi | IC FPGA SOC 10K LUTS | SmartFusion®2 | 0°C ~ 85°C (TJ) | - | Tray | - | 144-LQFP | - | 144-TQFP (20x20) | - | |
| 10AS022C4U19I3LG | Intel® FPGAs | 484-PIN UBGA | Arria 10 SX | -40°C ~ 100°C (TJ) | - | Tray | - | - | - | - | - |
A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.