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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
10AS022C3U19E2SG Intel® FPGAs 484-PIN UBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S025TS-1VFG400T2 Microsemi IC FPGA SOC Automotive, AEC-Q100, SmartFusion®2 -40°C ~ 125°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
XCZU2EG-1SFVA625I Xilinx IC FPGA 180 I/O 625FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -
XCZU2EG-2SFVA625I Xilinx IC FPGA 180 I/O 625FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 625-BFBGA, FCBGA - 625-FCBGA (21x21) -
10AS048H2F34E2SG Intel® FPGAs 1152-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
10AS066K3F35I3SGES Altera (Intel® Programmable Solutions Group) IC FPGA 396 I/O 1152FCBGA Arria 10 SX -40°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FBGA (35x35) -
XCZU19EG-2FFVB1517E Xilinx IC FPGA 644 I/O 1517FCBGA Zynq® UltraScale+™ MPSoC EG 0°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA - 1517-FCBGA (40x40) -
5ASXFB5G4F35C6N Altera (Intel® Programmable Solutions Group) IC FPGA 350 I/O 1152FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA 5ASXFB5 1152-FBGA (35x35) -
10AS022E4F27E3LG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S150TS-1FC1152 Microsemi IC FPGA SOC 150K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.