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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
5CSEBA4U23C7SN Intel® FPGAs IC FPGA 188 I/O 672UBGA Cyclone® V SE 0°C ~ 85°C (TJ) - Tray - 672-FBGA - 672-UBGA (23x23) -
M2S090-1FGG676I Microsemi IC FPGA SOC 90K LUTS 676FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 676-BGA M2S090 676-FBGA (27x27) -
XCZU19EG-2FFVC1760I Xilinx IC FPGA 512 I/O 1760FCBGA Zynq® UltraScale+™ MPSoC EG -40°C ~ 100°C (TJ) - Tray - 1760-BBGA, FCBGA - 1760-FCBGA (42.5x42.5) -
M2S050TS-1FG484M Microsemi IC FPGA SOC 50K LUTS 484FBGA SmartFusion®2 -55°C ~ 125°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
5ASTFD5K3F40I3NES Altera (Intel® Programmable Solutions Group) IC FPGA 528 I/O 1517FBGA Arria V ST -40°C ~ 100°C (TJ) - Tray - 1517-BBGA, FCBGA 5ASTFD5 1517-FBGA (40x40) -
XC7Z020-2CLG400CES Xilinx IC SOC CORTEX-A9 ARTIX-7 400BGA Zynq®-7000 0°C ~ 85°C (TJ) - Tray - 400-LFBGA, CSPBGA XC7Z020 400-CSPBGA (17x17) -
BCM3384DIFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
M2S060TS-1FGG484M Microsemi IC FPGA SOC SmartFusion®2 -55°C ~ 125°C (TJ) - Tray - 484-BGA - 484-FPBGA (23x23) -
BCM3384ZDUKFSBG Avago Technologies (Broadcom Limited) CABLE MODEM - - - - - - - - -
10AS048H4F34E3LG Intel® FPGAs 1152-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.