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Embedded - System On Chip (SoC)

Embedded - System On Chip (SoC)

  1. Products
  2. Integrated Circuits (ICs)
  3. Embedded - System On Chip (SoC)
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Image Part Number Manufacturer Description Series Operating Temperature Features Packaging Lead Free Status Package / Case Base Part Number Supplier Device Package Applications
1SX250LN3F43E2VG Intel® FPGAs 1760-PIN FBGA Stratix® 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
M2S005-VF256 Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 256-VFBGA - 256-BGA (17x17) -
M2S010-FGG484 Microsemi IC FPGA SOC 10K LUTS 484FBGA SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 484-BGA M2S010 484-FPBGA (23x23) -
M2S025TS-VFG400 Microsemi IC FPGA SOC 25K LUTS SmartFusion®2 0°C ~ 85°C (TJ) - Tray - 400-LFBGA - 400-VFBGA (17x17) -
10AS032E2F27E2LG Intel® FPGAs 672-PIN FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - - - - -
A2F500M3G-1FG256 Microsemi IC FPGA 500K GATES 512KB 256-BGA SmartFusion® 0°C ~ 85°C (TJ) - Tray - 256-LBGA A2F500M3G 256-FPBGA (17x17) -
10AS057K2F35E2SG Intel® FPGAs IC SOC FPGA 396 I/O 1152FBGA Arria 10 SX 0°C ~ 100°C (TJ) - Tray - 1152-BBGA, FCBGA - 1152-FCBGA (35x35) -
M2S005-1VFG256I Microsemi IC FPGA SOC 5K LUTS SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - 256-LBGA - 256-FPBGA (17x17) -
5ASXBB3D4F31C6N Altera (Intel® Programmable Solutions Group) IC FPGA 170 I/O 896FBGA Arria V SX 0°C ~ 85°C (TJ) - Tray - 896-BBGA, FCBGA 5ASXBB3 896-FBGA (31x31) -
M2S090-1FG676IX417 Microsemi IC FPGA SOC 90K LUTS 676FBGA SmartFusion®2 -40°C ~ 100°C (TJ) - Tray - - - - -

About Embedded - System On Chip (SoC)


A System On Chip (SoC) is a complete integrated circuit that contains most or all of the components required for a computing or electronic system on a single chip. These components typically include a central processing unit (CPU) or microcontroller, memory, input/output interfaces, and peripheral controllers. SoCs are designed to provide high performance and low power consumption while minimizing the size and complexity of the overall system. They are commonly used in embedded systems such as smartphones, tablets, IoT devices, and automotive electronics, where space, power, and cost constraints are critical considerations.